Yudong Li, Lam Research (USA)
Kang-Yi Lin, TEL Technology Center (USA)
Chen Li, Lam Research (USA)
Pingshan Luan, TEL Technology Center (USA)
Andrew J. Knoll, University of Akron (USA)
Dominik Metzler, IBM Corporation (USA)
Elliot Bartis, Institute for Defense Analyses (USA)
Nicholas Fox-Lyon, Meso Scale Diagnostics (USA)
Florian Weilnboeck, Infineon Technologies, AG (Germany)
Ming-Shu Kuo, Applied Materials Corporation (USA)
Robert L. Bruce, IBM Corporation (USA)
Sebastian Engelmann, IBM T.J. Watson Research Center (USA)
Xuefeng Hua, Intel Corporation (USA)
Li Ling, Applied Materials Corporation (USA)
Bryan Orf, Micron Technology (USA)
Neal Rueger, Micron Technology (USA)
Bernd Kastenmeier, IBM Corporation (USA)
Marc Schaepkens, General Electric Corporate R&D Center (USA)
Peter Matsuo, Fysix Corporation (USA)
Peter Wrschka, Infineon (USA)
Joseph Hernandez, IPEC SpeedFam (USA)
Marcus Doemling, Fysix Corporation (USA)
Theo Standaert, IBM Corporation (USA)
Li Ling, Applied Materials Corporation (USA)
Xuefeng Hua, Intel Corporation (USA)
M.S. Graduates
Bryan Orf
Xiang Wang
Gregor Dasbach
Ingo Martini
Eric Joseph
Eric Sanjuan
Former Visitors and Colleagues
Shiqiang Zhang
Sjaak Beulens, ASM International (Netherlands)
Masanaga Fukasawa, SONY Corporation (Japan)
Christer Hedlund, Uppsala University, Uppsala (Sweden)
Andrew Li, Lam Research (USA)
Hongjiang Sun, Philips Corporation (USA)
Masatoshi Tokushima, NEC Corporation (Japan)